Composition
GEL POLISH
BIS-TRIMETHYLBENZOYL PHENYLPHOSPHINE OXIDE, *******, CI 15985, CI 17200, CI 19140, *******, CI 77491, CI 77492, *******, CI 77510, CI 77742, CI 77742, *******, DI-HEMA TRIMETHYLHEXYL DICARBAMATE, HEMA, HYDROXYCYCLOHEXYL PHENYL KETONE, POLYACRYLATE-15 (*).
This product contains several compositions (GEL POLISH, REMOVER PADS) to find in the application.
(*) Ingredients are displayed in alphabetical order and some have been deliberately hidden (*******), to get the exact composition, please use our applications.
